Our design department has 10 qualified and highly skilled Engineers and Technicians, most with over 30 years of experience in the design of:

Integrated circuits (bipolar bicmos and cmos technologies)

Thick film hybrid technology

Printed circuit board assemblies in surface mount technology

We take customer concepts and propose solutions in appropriate technology for the intended  application and market.
 
We are focussed on collaborative product development, and our designers are proficient at working with customers to develop customer specific products, designed for specific markets, or to complement customer systems to provide customer product enhancement.

Design capabilities are based around proven CAD systems, which deliver design flows that result in high performance and optimum prototype lead-times.  The design output is subject to  high degrees of specification and performance verification.

Our Research and Development (R&D) programme brings continuous innovation into the business, which is confirmed through our many patents. Our customers also benefit through shared development programmes and application of innovative intellectual property. 

Integrated Circuits
The design flow for integrated circuits supports the conceptual ideas and wide experience within the group. The CAD tools then become the key to the design process, through schematic development, performance simulation and layout.

Prototype manufacturing by our outsourced fabrication sources then delivers engineering samples for characterisation, performance analysis and operational assessment.

An ongoing  qualification and reliability programme ensures specifications are met under extremes of environmental conditions.

Thick Film Hybrid Circuits
This technology can often provide the optimum solution to a customer’s needs. An analysis of the customer’s proposal is undertaken to identify and resolve key aspects of the circuit. Once the product specification is set, CAD layout and high quality manufacturing processes lead to prototyping of the thick film hybrid.

Surface Mount Board Assemblies
Circuit layout based on agreed customer specifications is carried out with design CAD tools, which enable multi layered and auto routing techniques to be implemented, to meet high density PCB requirements.

Product Verification and Testing
The design process in all the above cases includes high levels of in-house product testing capability and the development of production test specifications, to ensure that delivered product performance is fully guaranteed.

Our design success is based on our extensive semiconductor design and application expertise and our merged technologies capability.

Last Updated  23^rd May, 2007