We have over 20 years experience and expertise in the manufacturing of microelectronic components and assemblies.  We supply to markets that include automotive, telecommunication, appliance, medical and data interface applications.  The demands of these market segments are met through our highly skilled work force and a modern ISO 9000-2000 accredited manufacturing plant.

 We have specialised experience in :

Integrated Circuit Fabrication

 We have 30 years of experience in integrated circuit foundry activity, leading to capabilities that include:

• fabless operation with outsourced wafer fabrication
• wide packaging options to world standards
• in house slice probe testing
• in house integrated circuit testing
• qualification and life testing

 Hybrid Thick film on Ceramic Substrate

More than 20 years experience in supplying to the high demands of the global auto industry.

Capabilities include

• multi layer ceramic hybrid printing
• static and dynamic laser  trim
• robotic chip coating
• multiple pinning and conformal coating options
• in house high level automatic production and qualification testing

Surface Mount PCB Assembly Manufacturing

Surface mount and leaded component PCB assemblies for automotive, appliance and medical equipment manufacturers. This capability allows us to provide our customers with an enhanced product as a total solution. 

Capabilities include

• auto component gluing
• automatic surface mounting, reflow and wave soldering
• custom robotic assembly
• in house high level automatic production and qualification testing

Module and Product Assembly

 We have experience with manufacture and supply of complete products and module assemblies to markets where skilled assembly, testing, quality and reliability are critical.

Product Testing

 We have in-house capabilities to comprehensively test products from integrated circuits to complete electronic assemblies.  This is based around our expertise and experience in developing high speed automatic (ATE) testers, complex test interface cards for probe testing of IC slices, packaged ICs, hybrids and modules.

Please contact us for information on your manufacturing needs.

Last Updated  22^nd May 2007